Summary: | 碩士 === 國立成功大學 === 機械工程學系 === 87 === Micro-contact devices are widely used in many microsystems such as microflexural contact systems, electrostatic microswitches and so on. These devices play important roles in microsystems mainly to transfer signals between elements. In order to minimize the size, the weight and the pollution to environment, the industries of semiconductor and micro-electro-mechanical system (MEMS) have made great attempt to miniaturize their products recently. The essential objective of this study is to investigate the limit of size miniaturization, the structure and the reliability of micro-contact systems for better design and production.
Both the cantilever and the fixed-fixed types of micro beams are employed in this paper as the basic structures for the proposed micro contact systems. In order to design the micro contact systems that work under various loading conditions, a systematic modeling procedure is presented. The procedure is derived based on both the theory of beam and the law of scaling. The micro-contact system under various external influences of mechanical, electrostatic, electromagnetic, thermal, and the combined loadings are carefully examined. The dimension and size of the minimum acceptable design length and other physical parameters such as frequency and power are also mathematically formulated. In order to cross check the accuracy of the method proposed in this paper, the scanning probe microscope (SPM) is used to measure the deflection of the micro beam structure under an external applied load. The measured results are used to compare with the theoretical ones. The accuracy of the proposed method is experimentally verified. The results are satisfactory.
The numerical example also shows that the minimum design length of the micro contact system is significantly affected by the characteristics of materials being used. Other factors such use, the microsystem can be better off in terms of miniaturization. One can come up with better microsystems if research efforts can be further devoted toward the new as the cost of production and the available fabrication techniques are also important for microsystems in design process. If the material of higher strength is selected for development of microstructure materials and noval manufacturing technologies on microsystems of high aspect ratio.
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