| Summary: | 碩士 === 國立成功大學 === 機械工程學系 === 87 === Microelectronic materials are very small and most existing mechanical testers are too large for microelectronic materials and structures. More fundamental investigations need to be conducted in terms of constitutive laws, fracture process, failure quantities of materials widely used in electronic packaging.
A micro material tester has been developed at Cheng Kung University for investigating the behaviors of small specimen, particularly in the field of IC packaging materials and structures. The testing and calibrations of machine is described in this paper. Materials tested include a gold wire, paper films, and projection films.
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