The Manufacturing and Properties of Solder Bump with Electroless Ni/Electroplated Ni as the Under Bump Metallurgy
碩士 === 國立成功大學 === 材料科學及工程學系 === 87 === This research aims at the fabrication and properties of solder bump with electroless nickel and electroplated nickel as the under bump metallurgy on Al electrode. In this experiment, Al layer as the conductive layer was deposited with sputtering on 4...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/46653374879759425037 |
| Summary: | 碩士 === 國立成功大學 === 材料科學及工程學系 === 87 === This research aims at the fabrication and properties of solder bump with electroless nickel and electroplated nickel as the under bump metallurgy on Al electrode. In this experiment, Al layer as the conductive layer was deposited with sputtering on 4 inch wafer followed by lithography to form the desired bump pattern. Solder bump was then produced on the patterned specimen with electroless nickel or electroplated nickel as the under bump metallurgy. The experiment investigated the shear strength variation of bump with respect to process parameters and analyzed the reaction at the interface. It also investigated the barrier behaviors of the two under bump metallurgy during 30 seconds reflow at 235℃ and heat treatment at 150℃ for 1000 hours. The results reveal that the shear strength of electroplated nickel bump decreases with bump height. For the same bump height, the electroless nickel bump has higher shear strength than the electroplated nickel bump. The solder bumps all fracture at Al/Si interface during shear test with an average shear strength of 16.6~18.8 g. After 200 thermal cycles between -40℃ and 150℃, the shear strength of solder bump decreases to about 8 g. The intermetallic compounds formed during reflow for solder bumps with electroless nickel or electroplated nickel as the under bump metallurgy are Ni3Sn4 and Ni3Sn2. Electroless nickel with a thickness of 3.2μm and electroplated nickel with a thickness of 5.5μm can inhibit the interdiffusion between Al and solder during reflow at 235℃ and heat tretment at 150℃ for 1000 hours.
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