| Summary: | 碩士 === 國立成功大學 === 化學工程學系 === 87 === Abstract
In this research, several phosphorus-containing diamine compounds were synthesized for curing agents for the commercial epoxy resins and for the synthesized siloxane-type epoxy resins (SG80). The curing agents were characterized by the FT-IR, 1H-, 31P-NMR, EA and Mass spectrum, and the siloxane-type epoxy resins were characterized by the FT-IR, 1H-NMR. The curing behaviors and the reactivity of the system were investigated by the DSC and the degrees of curing were investigated by the extraction methods. The glass transition temperature and storage modulus of the pieces was measured by the DMA. The thermostability and the char residues of the cured pieces were determined by the TGA, and the flame retardancy properties were measured by the LOI.
The results showed that the synthesized phosphorus-containing diamine compounds showed different reactivity toward epoxides . Char yield and LOI measurements demonstrate that the incorporation of phosphorus into commercial or siloxane-type epoxy resins significantly improves their flame retardancy. According to these results, the phosphorus-containing diamine compounds as curing agent have better flame retardancy than conventional amine type curing agents.
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