The Establishment of Incoming Test Criteria for Electrontic Materials - Solder Paste Testing and Evaluation
碩士 === 華梵大學 === 工業管理學系碩士班 === 87 === The increase use of Surface Mount Technology (SMT) in Printed Circuit Board (PCB) assembly is a result of the need for reduced weight, volume and cost in electronic packaging. Solder paste that includes solder particles and flux binder is applied on the copper pa...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/79097735067427658471 |