| Summary: | 碩士 === 逢甲大學 === 工業工程學系 === 87 === Under the competitive manufacturing circumstance of semiconductor industry, it is an important task for semiconductor packaging plants to reduce the production lead-time for providing a quickly multi-production. Many manufacturers adopted First-in First-out (FIFO) or Earliest Due Date (EDD) as scheduling rules for multi-production, however, FIFO or EDD may minimize make span at a limited level.
For the above mention limitation, this research studies the characteristics of packaging firm, and then develops two mixed production models intending to get over this. In the first model, it processes the lot splitting under the virtual production line and finally schedules the production sequence. In the second model, it directly carry out lot splitting, without adopting virtual production line, and then put the production sequence in order.
According to computational results, the make spans of mixed production models both have better performances than the rules shortest processing time (SPT) or FIFO. The mixed production models shorten the make span of multi-products packaging, meanwhile, they create a competition advantage for the packaging industry.
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