| Summary: | 碩士 === 中華大學 === 機械與航太工程研究所 === 87 === Abstract
In accompany with the prosperous development on the technology, the electronic product has became and tended to be small, tiny, high speedy and high performance. As the above-mentioned trend of the development of the electronic product, the EMI (英文全名) phenomenon of the electronic product has became a serious issues needed to be resolved. The most effective solution to prevent the EMI is through the design of the outermost case of the electronic product for EMI shielding. If it is possible to develop a new method for combining the technology of the superplastic metallic forming and the plastic forming, which is utilized to manufacture the case of the electronic products, it can anticipate the electronic product not only has the efficiency of the metallic EMI shielding, but also has the flexibility of the plastic.
The purpose of this paper is focused on the requirement of the technology of the complex forming. First, the manufacturing by air flowing under the different condition of forming to do the experiment of the superplastic forming of Zn-22%Al alloy and the characteristic analysis for evaluating of the superplastic forming of Zn-22%Al alloy. Secondly, to study the forming of ABS plastic. Finally, based on the method of complex forming, in the order of ABS/Zn-Al/ABS, to observe the stickiness of the interface of testing board and study the feasibility of the complex forming technology.
The experimental results indicate that the excellent superplasticity of Zn-22%Al alloy is found. The attitude of the forming can reach up to the radius of the model. There is no cavitation produced in the microstructure and no distinctly change in the mechanical property after the forming. In the contrast, the forming of ABS plastic will produce the “burbles”when the temperature higher than 102 C degree during the forming and the forming is speedy. The experimental results for forming the ABS/Zn-Al/ABS sandwich compound board indicate that it would be better on the stickiness between the interface of testing board when the forming temperature is up to 150 C degree. In addition, the higher the pressure of forming, the better the stickiness between the interface. What we looking for are the lower forming temperature and the higher forming speedy for the mass production of the electronic products.
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