| Summary: | 碩士 === 淡江大學 === 機械工程學系 === 86 ===
Duo to the mature of semiconductor process technology, the study on the MEMS "Micro Electro Mechanical System" is will developing. Micro joining structures can be applied to bio-engineering, aerospace - engineering and medical engineering.
In the paper, we use semiconductor process to sfabricate many micro elastic deflection of Sio2 and SINx flanges angles on (100) silicon wafer that acts as mechanical adhesives structure between two wafer surfaces.
The micro structures fastening system do not need any chemical adhesive, heat or ultrasonic vibrations, it is a pure mechanical interlocking devic e. The structure is 18□m x 18□m by 12□m high , there are approximately 200,000 individual structure per cm2 of substrate, resulting in a strong strength of the join to be in excess of 400kpa.
We have make some database for the fabrication process of the micro structures. The result can apply t the areas where need micro joining structureds including medical uses (joinging tissues) and IC packaging.
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