Analysis of heat transfer for packaged IC

Analysis of heat transfer for packaged IC

碩士 === 東海大學 === 化學工程學系研究所 === 86 === The main purpose of this research is to develop a heat transfer program for packaged IC by using the finite differencenumerical analysis method. The simulated IC is epoxy packaged with copper(Cu) and aluminum(Al) lead frame and 16,20,28 and 40 pi...

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Main Authors: Lin,Sue-Mei, 林淑美
Other Authors: Chang,You-Im
Format: Others
Language:zh-TW
Published: 1998
Online Access:http://ndltd.ncl.edu.tw/handle/99450964597976320794
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spelling ndltd-TW-086THU000630022015-10-13T17:34:44Z http://ndltd.ncl.edu.tw/handle/99450964597976320794 Analysis of heat transfer for packaged IC 半導體IC封裝後晶片熱傳導現象之分析 Lin,Sue-Mei 林淑美 碩士 東海大學 化學工程學系研究所 86 The main purpose of this research is to develop a heat transfer program for packaged IC by using the finite differencenumerical analysis method. The simulated IC is epoxy packaged with copper(Cu) and aluminum(Al) lead frame and 16,20,28 and 40 pins. Heat generated by the operation of IC is proved to be bring out by the lead frame. It is found that heat conductivity and pin numbers havepositive contribution to the power dissipation of the lead frame.-1 -aAnalysis of heat transfer for packaged IC Chang,You-Im Wu,Cherng-Chiao 張有義 吳澄郊 1998 學位論文 ; thesis 1 zh-TW
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language zh-TW
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description 碩士 === 東海大學 === 化學工程學系研究所 === 86 === The main purpose of this research is to develop a heat transfer program for packaged IC by using the finite differencenumerical analysis method. The simulated IC is epoxy packaged with copper(Cu) and aluminum(Al) lead frame and 16,20,28 and 40 pins. Heat generated by the operation of IC is proved to be bring out by the lead frame. It is found that heat conductivity and pin numbers havepositive contribution to the power dissipation of the lead frame.-1 -aAnalysis of heat transfer for packaged IC
author2 Chang,You-Im
author_facet Chang,You-Im
Lin,Sue-Mei
林淑美
author Lin,Sue-Mei
林淑美
spellingShingle Lin,Sue-Mei
林淑美
Analysis of heat transfer for packaged IC
author_sort Lin,Sue-Mei
title Analysis of heat transfer for packaged IC
title_short Analysis of heat transfer for packaged IC
title_full Analysis of heat transfer for packaged IC
title_fullStr Analysis of heat transfer for packaged IC
title_full_unstemmed Analysis of heat transfer for packaged IC
title_sort analysis of heat transfer for packaged ic
publishDate 1998
url http://ndltd.ncl.edu.tw/handle/99450964597976320794
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AT línshūměi bàndǎotǐicfēngzhuānghòujīngpiànrèchuándǎoxiànxiàngzhīfēnxī
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