The Stress Analysis of Various Undercoats and Substrates in Ti10/W90 Sputter Coatings

• Main Authors: Chen Kang, 陳罡
• Other Authors: Chung Yen-Ling
• Format: Others
• Language: zh-TW
• Published: 1998
• Online Access: http://ndltd.ncl.edu.tw/handle/60223045361490079194

碩士 === 國立臺灣科技大學 === 營建工程技術學系 === 86 === The purpose of this study is to analyze the stress behaviors of the substrate-diffusion barriers composite material subjected to the thermal loading by means of the finite element method. In this is study, the Ti10/W90 sputter coating is used as the diffusion barrier; the material of Al, Ti, or invar is considered to be used as the substrate. The effects of the substrate material, the coating thickness, the undercoat, the interfacial grooves, and the interfacial textures on the stress distributions of the diffusion barrier TiW are under consideration.The results show that (1) invar is the best substrate material among Al, Ti, and invar; (2) the increase of the thickness of TiW will accelerate the debonding of the sputter coating; (3) the undercoat between the substrate and Tiw , and the grooves on the surface of the substrate will prevent TiW from spallation; (4) however, the textures on the surface of the substrate cause the stress concentrations that are helpless to avoid TiW from debonding.