Study on Wire Sweep and Warpage Problem of IC Package
碩士 === 國立臺灣大學 === 機械工程學系研究所 === 86 === During IC encapsulation filling process, the epoxy would exert drag force on wires and cause wire sweep. If the neighbor wires touch, short-circuit occur. With the trend of more wires, less wire distance and thinner...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/60577650077769599187 |