ISO 10303-Based PCB Assembly Data Model for Assembly Analysis

• Main Author: 徐政斌
• Other Authors: 張瑞芬
• Format: Others
• Language: zh-TW
• Published: 1998
• Online Access: http://ndltd.ncl.edu.tw/handle/14961662994914803959

碩士 === 國立清華大學 === 工業工程研究所 === 86 === Today, time is one of key factors in making a company to be the best in its industry. Translating information correctly and efficiently would not only reduce the time required to communicate between departments within a company, but it is also between different companies. STEP, comprising of many application protocols, is a standard for the exchange of product model data that has a great capability of describing product shape and managing product information. Therefore, effective information translation and the Concurrent Engineering (CE) concept would be implemented by STEP. AP 210, a committee draft document, is an application protocol that describes PCB Assembly product design data. This paper focuses on the data modeling of PCB Assembly that based on STEP. Moreover, a physical data base developed by those data models is used for the decision analysis application program which will do some critical analysis work about PCB Assembly.