System Design and Preliminary Analysis of Cylindric Polishing Process
碩士 === 國立中山大學 === 機械工程研究所 === 86 === The aim of this thesis is to develop a new cylindric polishing process which is applied to the manufacture of bare wafer with large diameter.The wafer surface is required to be smooth, damage free, and flat.Among the steps of wafer manufacturing, the polishing pr...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/52191309079636358380 |