Silicon-SOG-Silicon Anodic Bonding Technology for MEMS Application
碩士 === 國立交通大學 === 應用化學研究所 === 86 === Silicon to silicon anodic bonding by use of sputter deposited borosilicate film is a promising mounting method for microelectromechanical systems (MEMS).The advantages of the silicon to silicon anodic bonding were like its reliability and flexibility in contra...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/37360562507480978490 |