Roles of Dynamic Characteristics on Physical Behavior During Chemical Mechanical Planarization process
碩士 === 國立交通大學 === 機械工程研究所 === 86 === CMP (Chemical mechanical polishing) is recognized to be of critical importance to high performance interconnect technology. In the CMP process, although conventional CMP technology can process characteristics such as removal rate, nonuniformity, degree of plan...
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| Format: | Others |
| Language: | en_US |
| Published: |
1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/31660510264480946401 |