Asymptotic Equivalent Network of the Heat Transfer in PCB And the Design of the Associated Library Models in SPICE

• Main Authors: Shiu, Chai Chi, 徐佳祺
• Other Authors: Chang Lon-Kou
• Format: Others
• Language: zh-TW
• Online Access: http://ndltd.ncl.edu.tw/handle/13349044221607883979

碩士 === 國立交通大學 === 電機與控制工程學系 === 86 === As the manufacture and packaging technology of integrated circuits has been rapidly developed so far, power IC's and multichip become more demanded. Heattransfer simulation of PCB's and IC packages are very important for designingthe circuits with high reliability and accuracy. In this thesis, the partialdifferential equations for computing heat transfer in PCB's and IC packagesare approximated by using the finite difference method. We have proposed efficient equivalent circuit models to simulate the heat transfer mechanismof PCB's and IC's. We have also include the complicate wiring models of PCB'sin our first version of PCB's model. The tranditional equivalent circuit modelfor the heat transfer of an IC is a three-dimension one. The objects of the modeling mothed proposed by us is to simplify the three-dimemsion model intotwo-dimension one. Thus, we proposed an asymptotic method to produce the twodimensional transient-state model of the heat trasfer in an IC. In addition, more works have been done here,such as, (1) the method to separate the equivalent circuits produced by the ambient temperature and the electricalpower consumed by IC, and (2) the improvement of the mesh-refinement model ofthe PCB in previous version. The simulation results have already shown thatour models can highly improve the effciency of the simulation time and memorysize.