The Optimized Analysis for Paddle Shift of IC Lead Frame

碩士 === 中原大學 === 機械工程研究所 === 86 === IC plastic packages have become one of the most important semiconductor products as the related technologies and applications grow rapidly. As IC packages becomes smaller, thinner and denser in recent years, more challengeshave come. The deformation of i...

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Bibliographic Details
Main Authors: Shih Chia-Chien, 史佳乾
Other Authors: Wen-Ren Jong
Format: Others
Language:zh-TW
Published: 1998
Online Access:http://ndltd.ncl.edu.tw/handle/75429523618144332930