The thermal characteristics analysis, prediction and simulation of IC packaging
博士 === 中正理工學院 === 國防科學研究所 === 86 === Abstract The purpose of this dissertation is to analyze the thermal characteristics and to predict the steady state temperature of Integrated Circuit (IC) packages. To obtain the thermal characteristics of IC packages, two sets of test chips were...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/53680662136856157333 |