Preparation of conductive hiigh - strength copper alloys by mechanical alloying

• Main Authors: Sang, Wei-Ching, 桑維清
• Other Authors: Hsin-Ming Wu
• Format: Others
• Language: zh-TW
• Published: 1997
• Online Access: http://ndltd.ncl.edu.tw/handle/49113829439174210554

碩士 === 大同工學院 === 材料工程學系 === 85 === Copper is widely used in conductive material because pure copper have good conductive property.But copper applicability is limited by its` porr mechanical strength and friction bearing.We attempt to product high strength and conductive dispertion - strength copper base material with pure copper(99.95%), transionmetal Ti and graphite staring powder by mechanical alloying. We will analyze the powder which was ball milled and vacuum sintered by electron microscope ,Xrd.From reasult, carburet TiC will form by C diffusion into Ti lattice. From particle size, Cu-Ti-C powders particle size will decrease with increase TiC containing. It means TiC will restrain coll welding. TiC will uniform disperse in copper base alloying .The TiC particle size is 21nm.The hadrness will increase with increase ball-milled time and TiC containing after ball- milled. The work hardness will be eliminated by sintering. The hardness will increasewith TiC cintaining increaseing at this time. The density is (6~7 gm/cm3)lower than theory density after 950C, 48 hr sintering. The electron resistance is 2~7*10-4 is higher than prue theory data.The reason is containing pore. The tensile strength is 1000MPa.It is 5 times of pure copper.