| Summary: | 碩士 === 國立中央大學 === 機械工程學系 === 85 === Spin coating is utilized extensively in the microelectronics
industry to form a thin uniform film of photoresist or polyomide
on silicon wafers.Dispensation time will affect the amount of
liquid dispensed.Therefore,how to reduce the coating time is the
point in this study.The numerical results show that the nozzle
diameter smaller, the faster coatingvelocity is.And the coating
velocity is faster,when the volume rate is higher.Besides,in the
process of spin coating on 12-inch diameter wafer,both the
nozzle sizeand volume rate must be bigger.Considering the
effects,we use three kinds of nozzle size to simulation.The
results show that although the nozle size is biggerbut we dont't
need to use so mush liquid quantity to reach the same flow
velocityas the smaller nozzle.We can only add fewer amount of
liquid to get the same coating performance in the smaller
nozzle.So that we can reduce the amount ofliquid dispensed in
the case of 12-inch diameter wafer.
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