The Novel Electric Packaging Si/Cu composite Fabriated with Powder Metrallurgy (P/M) Method
碩士 === 國立中央大學 === 機械工程學系 === 85 === Copper-Matrix silicon particulate dispersed composites were fabricated with Powder Metallurgy (P/M) method.This reasearch try to combine the advantage of copper''s high thermal conductivity and the silicon...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1997
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75247030845814568114 |