| Summary: | 碩士 === 國立交通大學 === 控制工程系 === 85 === In this thesis, the partial differential equations for computing
heat transferin PCB's and IC packages are approximated by using
the finite difference method. We have proposed efficient
equivalent circuit models to simulate the heat transfer
mechanism of PCB's and IC's. We have also considered the
complicate wiring models of PCB's in our simulation. In the
modeling of IC's, we also pro-posed the asymptotic equivalent
method to transfer the traditional three dimen-sion equivalent
circuits of IC's into two dimension asymptotic equivalent cir-
cuits. With the usage of this method, the simulation computation
time and com-puter memory size can be reduced greatly. The
asymptotic equivalent network ofIC's are used to build the
library models designed in SPICE. According to ourconsideration
of the accuracy, we can determine the order of simplified
modelsi.e. different asymptotic equivalent models.
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