Experimental and Numerical Analysis of Wire Sweep in IC Packaging

Experimental and Numerical Analysis of Wire Sweep in IC Packaging

碩士 === 國立成功大學 === 機械工程學系 === 85 === Wire sweep is a critical process defect in the era of miniaturization of IC. This is because with wire sweep wires may contact each other or even be broken and become short circuit. Unfortunately, the physical nature of wire sweep is still not very clear. Thi...

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Bibliographic Details
Main Author: 金虹
Other Authors: 黃聖杰
Format: Others
Language:zh-TW
Published: 1997
Online Access:http://ndltd.ncl.edu.tw/handle/67771167360404794524
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spelling ndltd-TW-085NCKU34890152015-10-13T17:59:20Z http://ndltd.ncl.edu.tw/handle/67771167360404794524 Experimental and Numerical Analysis of Wire Sweep in IC Packaging IC封膠內金線偏移現象之實驗與理論分析 金虹 碩士 國立成功大學 機械工程學系 85 Wire sweep is a critical process defect in the era of miniaturization of IC. This is because with wire sweep wires may contact each other or even be broken and become short circuit. Unfortunately, the physical nature of wire sweep is still not very clear. This paper presents theoretical works on results and wire sweep. With this analysis, both flow induced loads on the wires and models to predict the amount of wire sweep for different viscosity and velocity of fluid are found. 黃聖杰 1997 學位論文 ; thesis 72 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立成功大學 === 機械工程學系 === 85 === Wire sweep is a critical process defect in the era of miniaturization of IC. This is because with wire sweep wires may contact each other or even be broken and become short circuit. Unfortunately, the physical nature of wire sweep is still not very clear. This paper presents theoretical works on results and wire sweep. With this analysis, both flow induced loads on the wires and models to predict the amount of wire sweep for different viscosity and velocity of fluid are found.
author2 黃聖杰
author_facet 黃聖杰
金虹
author 金虹
spellingShingle 金虹
Experimental and Numerical Analysis of Wire Sweep in IC Packaging
author_sort 金虹
title Experimental and Numerical Analysis of Wire Sweep in IC Packaging
title_short Experimental and Numerical Analysis of Wire Sweep in IC Packaging
title_full Experimental and Numerical Analysis of Wire Sweep in IC Packaging
title_fullStr Experimental and Numerical Analysis of Wire Sweep in IC Packaging
title_full_unstemmed Experimental and Numerical Analysis of Wire Sweep in IC Packaging
title_sort experimental and numerical analysis of wire sweep in ic packaging
publishDate 1997
url http://ndltd.ncl.edu.tw/handle/67771167360404794524
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