Wetting Behavior Between Electroless Nickel and Sn-Zn-Al Solder
碩士 === 國立成功大學 === 材料科學(工程)學系 === 85 === This study is to investigate the wetting behavior between the copper substrate which was deposited with electroless nickel as a diffusion barrier for the ternary eutectic Sn-Zn-Al solder. The copper plating was depo...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1997
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| Online Access: | http://ndltd.ncl.edu.tw/handle/38467090652350630105 |