The Sintering Structure of AG-PdThick Film Included Glass

• Main Authors: Sheu, Liang-Jieh, 許良价
• Other Authors: J.C. Lin
• Format: Others
• Language: zh-TW
• Published: 1996
• Online Access: http://ndltd.ncl.edu.tw/handle/13300707904996586321

碩士 === 國立中央大學 === 機械工程學系 === 84 === Bounder is helpful for the increase of the adhesion between thick-film and abstract, but it has different effect of the mechanism of sinteringand microstruture. There are two kinds of bounder:glass, and oxide. Tounderstand the effect between powder sintering and liquid sintering, we choose B-9(high-glass material) to study how glass addition affect the sintering and thick-film microstrucure of Ag15%Pd alloy. According to the thick-film property, we conclude a better glass addition percent.Because of the difference of sintering behaviers betweenalloy and mixed AgPd powder,we will compare the difference in the thick film include10wt% b-9 after sintering.We will inspect the components and microstructurewith the addiation of SEM,XRD and TGA. According the situation of impactingto explende the difference of performance of solder wetting , conduction and adhesion.