| Summary: | 碩士 === 國立中央大學 === 機械工程學系 === 84 === Bounder is helpful for the increase of the adhesion between
thick-film and abstract, but it has different effect of the
mechanism of sinteringand microstruture. There are two kinds of
bounder:glass, and oxide. Tounderstand the effect between powder
sintering and liquid sintering, we choose B-9(high-glass
material) to study how glass addition affect the sintering and
thick-film microstrucure of Ag15%Pd alloy. According to the
thick-film property, we conclude a better glass addition
percent.Because of the difference of sintering behaviers
betweenalloy and mixed AgPd powder,we will compare the
difference in the thick film include10wt% b-9 after sintering.We
will inspect the components and microstructurewith the addiation
of SEM,XRD and TGA. According the situation of impactingto
explende the difference of performance of solder wetting ,
conduction and adhesion.
|
|---|
