FLIP-CHIP BONDING OF GaAs on Si SUBSTRATES AND ITS APPLICATION TO SEMICONDUCTOR LASERS
碩士 === 國立交通大學 === 電子研究所 === 84 === For enhancement of functionality and performance on a single substrate, hybrid integration of dissimilar materials has been an issue with increasingimportance. Much effort has been devoted to direct wafe...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1996
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| Online Access: | http://ndltd.ncl.edu.tw/handle/15637865982429348829 |