The Al/Mo/Pd and Al/Mo-N/Pd Thin Films were Investigated as the under Bump Metallurgy between Silicon and Solder
碩士 === 國立成功大學 === 材料科學(工程)學系 === 84 === In this research, the Al/Mo/Pd and Al/r-Mo2N/Pd films were investigated thin for the potential applications as the under bump metallurgy between silicon and solder.The Al/Mo/Pd and Al/r-Mo2...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1996
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| Online Access: | http://ndltd.ncl.edu.tw/handle/90336983823867542958 |