The Interfacial Reactions and the Microstructural Changes at High Temperature under Controlled Atmosphere in the Copper and Alumina System

• Main Authors: Hsu, H.H., 徐宏輝
• Other Authors: F.H.Lu
• Format: Others
• Language: zh-TW
• Published: 1996
• Online Access: http://ndltd.ncl.edu.tw/handle/23639933306502746235

碩士 === 國立中興大學 === 材料工程學研究所 === 84 === This research focused on the interfacial reactions and the microstructural changes in the Cu/Al2O3 system at 1000℃under controlled atmosphere.Different types of Cu (foils, plates)/Al2 O3 (pellets, powders) samples were used in this study. The main objectives of this research are listed below.1.Study of the interfacial reactions: Oxygen partial pressures and time have been varied. The resulted microstructural changes at the Cu/Al2 O3 interfaces have been studied by using optical microscopy, scanning electron microscopy(+EDS) and X-ray diffractometer. The reaction phases at the Cu/Al2O3 interfaces are consistent with those predicted by thermodynamics.2.Thermogravimetric study. The weight changes of samples were measured in air and in N2 by the thermogravimetric analyzer. The relationships between the weight changes and the reaction phase at the Cu/Al2O3 interfaces were discussed.