A packaging system for built-in microcircuits in MCM-C substrates

碩士 === 高雄工學院 === 電機工程研究所 === 84 ===

Bibliographic Details
Main Authors:	Fang, Fei Qun, 方斐群
Other Authors:	Huang, You Rong
Format:	Others
Language:	zh-TW
Published:	1996
Online Access:	http://ndltd.ncl.edu.tw/handle/67496975646821909068

id	ndltd-TW-084ISU02442002
record_format	oai_dc
spelling	ndltd-TW-084ISU024420022015-10-13T12:28:53Z http://ndltd.ncl.edu.tw/handle/67496975646821909068 A packaging system for built-in microcircuits in MCM-C substrates 內含微電路之MCM-C基板設計研究 Fang, Fei Qun 方斐群碩士高雄工學院電機工程研究所 84 Huang, You Rong 黃有榕 1996 學位論文 ; thesis 0 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 高雄工學院 === 電機工程研究所 === 84 ===
author2	Huang, You Rong
author_facet	Huang, You Rong Fang, Fei Qun 方斐群
author	Fang, Fei Qun 方斐群
spellingShingle	Fang, Fei Qun 方斐群 A packaging system for built-in microcircuits in MCM-C substrates
author_sort	Fang, Fei Qun
title	A packaging system for built-in microcircuits in MCM-C substrates
title_short	A packaging system for built-in microcircuits in MCM-C substrates
title_full	A packaging system for built-in microcircuits in MCM-C substrates
title_fullStr	A packaging system for built-in microcircuits in MCM-C substrates
title_full_unstemmed	A packaging system for built-in microcircuits in MCM-C substrates
title_sort	packaging system for built-in microcircuits in mcm-c substrates
publishDate	1996
url	http://ndltd.ncl.edu.tw/handle/67496975646821909068
work_keys_str_mv	AT fangfeiqun apackagingsystemforbuiltinmicrocircuitsinmcmcsubstrates AT fāngfěiqún apackagingsystemforbuiltinmicrocircuitsinmcmcsubstrates AT fangfeiqun nèihánwēidiànlùzhīmcmcjībǎnshèjìyánjiū AT fāngfěiqún nèihánwēidiànlùzhīmcmcjībǎnshèjìyánjiū AT fangfeiqun packagingsystemforbuiltinmicrocircuitsinmcmcsubstrates AT fāngfěiqún packagingsystemforbuiltinmicrocircuitsinmcmcsubstrates
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A packaging system for built-in microcircuits in MCM-C substrates

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