| Summary: | 碩士 === 逢甲大學 === 材料科學研究所 === 84 === Operation parameters of electroless nickel (EN) plating onto
silicon , such as plating bath （E-Chem , OKUNO and GIT）,
activation , and sintering , were studied . The microstructure
of coating layers was examined by XRD , AES , SEM , TEM , and
XRF .Experimental results show that all kinds of the plating
solutions are good for EN deposition . Suitable activation
process can improve the wettability and adhesion of the samples
. Sintering temperature between 500 and 550℃ is acceptable
.OKUNO sample is more porous than GIT sample . The poorer
adhesive strength of OKUNO samples is probably caused by the
out-diffusion of nickel , silicon and phosphorus , followed by
oxidation on the surface
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