Three-Dimensional Analysis of Heat Transfer and Fluid Flow During Rapid Thermal Processing
碩士 === 元智大學 === 機械工程研究所 === 83 === A numerical study of heat transfer and fluid flow has been made relative to rapid thermal processing (RTP) in manufacturing microelectronics on a silicon wafer.The two and three- dimensional temperature and velocity fiel...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/69768342202887199242 |