| Summary: | 碩士 === 國立雲林科技大學 === 機械工程技術研究所 === 83 === The objective of this research is to develop an object
inspection system using multi-sensor, for its performance
evaluation. The developed system is used to inspect surface
mount device(SMD)and lead-frame component. These 3-D objects
are small in size, thus it's difficult to detect defects of
them sololy from a 2-D image. In SMD inspection, gray
level image and structured light are employed. We
developed a surface shape estimation technique for solder
joint using slant map. From this technique,a solder joint
can be determined to be a good(concave), bad (convex),
bridging one ,or with insufficient solder, excess solder,
dewetting solder. The lead-frame inspection technique we
developed uses a multi-sensor system which includes a 2-D
video camera and a laser range sensor mounted on a robot
gripper. The developed technique uses the global features of
a 3-D object such as hole number, area, perimeter,and range
data. These features are found to be rather stable under
noisy environment. Range data obtained from a laser range
sensor is suitable for 3-D object inspection for it is not
affected by the object's surface conditions such as the
color, reflectivity or roughness.Using the developed system,
lead-frame can be determined to be in one of these four
configurations : (1)frontage with component (2)back with
component (3)frontage without component (4)back without
component.
|
|---|
