The model of temperature distribution in integrated circuits

• Main Authors: Jei-feng Hwang, 黃志豐
• Other Authors: Jeng Gong
• Format: Others
• Language: zh-TW
• Published: 1995
• Online Access: http://ndltd.ncl.edu.tw/handle/24114161288858052187

碩士 === 國立清華大學 === 電機工程研究所 === 83 === The design of power integrated circuits (PIC) is strongly influenced by the chip''s behavior of dissipating the power produced by high output cu- rrents and high voltages. The electrical characte- ristics of the circuits depend on the thermal dis- tribution on the semiconductor surface. The present trend is to integrate more and more sensing and control circuits with high power devices, such as the smart power families. So, the designer needs to forecast the electrothermal interactions in a very early stage, while designing a power chip. In this paper, three existed temperature- distribution models will be reviewed. And a new modified model is proposed. This new model has no tedious mathematics; yet, it provides very accu- rate results. Also, a temperature sensor IC is designed and fabricated to verify this model. The verification of the models are completed by designing a temperature sensor IC. The modified model has a good match with the measured results if the IC package effect is considered.