The TPR and Surface Characteristics Study of Copper Catalysts
碩士 === 逢甲大學 === 化學工程研究所 === 83 === The study uses three different methods,i.e.,the impregnation method, urea hydrolysis precipitation method and electroless copper plating, respectively to prepare several copper/alumina catalysts with diffe...
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ndltd-TW-083FCU000630102016-02-08T04:06:39Z http://ndltd.ncl.edu.tw/handle/73463776464228857920 The TPR and Surface Characteristics Study of Copper Catalysts 銅觸媒表面特性之TPR研究 Yech,Chii Ruey 葉啟瑞 碩士 逢甲大學 化學工程研究所 83 The study uses three different methods,i.e.,the impregnation method, urea hydrolysis precipitation method and electroless copper plating, respectively to prepare several copper/alumina catalysts with different copper loadings. A continuous fixed- bed microreactor system was used to study the metal interaction relationship between the catalysts and the alumina support through the Temperature-Programmed Reduction . It is found that the unsupported cupric oxide has the largest reduction temperature at about 330℃. The reduction temperature found for different alumina supported catalysts are described as below. For the copper catalyst prepared by electroless copper plating method, which uses EDTA as the chelating agent, the maximum reduction temperature is found at about 220℃; after calcination, the reduction temperature tends to move to lower temperature, though the change is not large. On the other hand, the copper catalyst prepared by the same method as the above but uses TEA as the chelating agent shows maximum reduction temperature at about 195℃; after calcination , the reduction temperature exhibits the tendency to move to higher temperatures with a small change. For copper catalyst prepared by the impregnation method, the largest reduction temperature is found to increase from 220-260℃, along with the increase in the copper loading. For the copper catalyst prepared by the deposition-precipitation method the largest reduction temperature is found at about 200℃, which increase with the increase in the copper loading. The change in the temperature is not large for the copper prepared from the deposition- precipitation method, which is similar to the catalyst prepared in the electroless plating method. Chang,Hsin Fu 張新福 1995 學位論文 ; thesis 87 zh-TW |
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zh-TW |
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Others
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description |
碩士 === 逢甲大學 === 化學工程研究所 === 83 === The study uses three different methods,i.e.,the impregnation
method, urea hydrolysis precipitation method and electroless
copper plating, respectively to prepare several copper/alumina
catalysts with different copper loadings. A continuous fixed-
bed microreactor system was used to study the metal interaction
relationship between the catalysts and the alumina support
through the Temperature-Programmed Reduction . It is found that
the unsupported cupric oxide has the largest reduction
temperature at about 330℃. The reduction temperature found for
different alumina supported catalysts are described as below.
For the copper catalyst prepared by electroless copper plating
method, which uses EDTA as the chelating agent, the maximum
reduction temperature is found at about 220℃; after
calcination, the reduction temperature tends to move to lower
temperature, though the change is not large. On the other hand,
the copper catalyst prepared by the same method as the above
but uses TEA as the chelating agent shows maximum reduction
temperature at about 195℃; after calcination , the reduction
temperature exhibits the tendency to move to higher
temperatures with a small change. For copper catalyst prepared
by the impregnation method, the largest reduction temperature
is found to increase from 220-260℃, along with the increase in
the copper loading. For the copper catalyst prepared by the
deposition-precipitation method the largest reduction
temperature is found at about 200℃, which increase with the
increase in the copper loading. The change in the temperature
is not large for the copper prepared from the deposition-
precipitation method, which is similar to the catalyst prepared
in the electroless plating method.
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author2 |
Chang,Hsin Fu |
author_facet |
Chang,Hsin Fu Yech,Chii Ruey 葉啟瑞 |
author |
Yech,Chii Ruey 葉啟瑞 |
spellingShingle |
Yech,Chii Ruey 葉啟瑞 The TPR and Surface Characteristics Study of Copper Catalysts |
author_sort |
Yech,Chii Ruey |
title |
The TPR and Surface Characteristics Study of Copper Catalysts |
title_short |
The TPR and Surface Characteristics Study of Copper Catalysts |
title_full |
The TPR and Surface Characteristics Study of Copper Catalysts |
title_fullStr |
The TPR and Surface Characteristics Study of Copper Catalysts |
title_full_unstemmed |
The TPR and Surface Characteristics Study of Copper Catalysts |
title_sort |
tpr and surface characteristics study of copper catalysts |
publishDate |
1995 |
url |
http://ndltd.ncl.edu.tw/handle/73463776464228857920 |
work_keys_str_mv |
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