The TPR and Surface Characteristics Study of Copper Catalysts

碩士 === 逢甲大學 === 化學工程研究所 === 83 === The study uses three different methods,i.e.,the impregnation method, urea hydrolysis precipitation method and electroless copper plating, respectively to prepare several copper/alumina catalysts with diffe...

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Bibliographic Details
Main Authors: Yech,Chii Ruey, 葉啟瑞
Other Authors: Chang,Hsin Fu
Format: Others
Language:zh-TW
Published: 1995
Online Access:http://ndltd.ncl.edu.tw/handle/73463776464228857920
Description
Summary:碩士 === 逢甲大學 === 化學工程研究所 === 83 === The study uses three different methods,i.e.,the impregnation method, urea hydrolysis precipitation method and electroless copper plating, respectively to prepare several copper/alumina catalysts with different copper loadings. A continuous fixed- bed microreactor system was used to study the metal interaction relationship between the catalysts and the alumina support through the Temperature-Programmed Reduction . It is found that the unsupported cupric oxide has the largest reduction temperature at about 330℃. The reduction temperature found for different alumina supported catalysts are described as below. For the copper catalyst prepared by electroless copper plating method, which uses EDTA as the chelating agent, the maximum reduction temperature is found at about 220℃; after calcination, the reduction temperature tends to move to lower temperature, though the change is not large. On the other hand, the copper catalyst prepared by the same method as the above but uses TEA as the chelating agent shows maximum reduction temperature at about 195℃; after calcination , the reduction temperature exhibits the tendency to move to higher temperatures with a small change. For copper catalyst prepared by the impregnation method, the largest reduction temperature is found to increase from 220-260℃, along with the increase in the copper loading. For the copper catalyst prepared by the deposition-precipitation method the largest reduction temperature is found at about 200℃, which increase with the increase in the copper loading. The change in the temperature is not large for the copper prepared from the deposition- precipitation method, which is similar to the catalyst prepared in the electroless plating method.