Fomula and Physical Properties of Acrylate/Epoxy film type electrical devices encapsulant material.

Fomula and Physical Properties of Acrylate/Epoxy film type electrical devices encapsulant material.

碩士 === 國立清華大學 === 化學工程研究所 === 82 ===

Bibliographic Details
Main Authors:	Cuo, E-van, 郭依凡
Other Authors:	Chin, Wei-Kuo
Format:	Others
Language:	zh-TW
Published:	1994
Online Access:	http://ndltd.ncl.edu.tw/handle/58741120222325377485

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