Fabrication of the package of vertical emitting semiconductor laser

碩士 === 國立交通大學 === 光電(科學)研究所 === 82 === This thesis is to study a novel technology of the fabrication of a vertical emitting semiconductor laser.this technique is a combination of an edge emitting semiconductor laser and a silicon micro-mach...

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Bibliographic Details
Main Authors: Li Jiann Chang, 李建昌
Other Authors: Shie Jin Shown
Format: Others
Language:zh-TW
Published: 1994
Online Access:http://ndltd.ncl.edu.tw/handle/12890215033972556247
Description
Summary:碩士 === 國立交通大學 === 光電(科學)研究所 === 82 === This thesis is to study a novel technology of the fabrication of a vertical emitting semiconductor laser.this technique is a combination of an edge emitting semiconductor laser and a silicon micro-machining U-groove which has forty-five degree mirror-like oblique planes made by oxidation-smooth method.With the edge emitting semiconductor laser packaged on the bottom of the U-groove,reflected light will be perpendicular to the incident light,that is,as a vertical emitting semiconductor laser.This vertical emitting structure with simplifying laser package has the advantage for automation.