Manufacture of Particleboards Using Powdered Urea-forma- -ldehyde and Phenol-formaldehyde Adhesives

• Main Authors: Ru-Hey Chiou, 邱儒慧
• Other Authors: Cheng-Tzu Liu
• Format: Others
• Language: zh-TW
• Published: 1994
• Online Access: http://ndltd.ncl.edu.tw/handle/96990468868381621427

碩士 === 國立中興大學 === 森林學系 === 82 === The objective of this study was to investigate how the board properties were influenced by the synthetic method of resin and board manufacturing conditions. The particleboards and wafer- boards were manufactured by using commercial powdered UF resin and PF resin synthesized in the laboratory. The results are presented as follows: 1. The mechanical properties of boards using powdered UF resin became stronger with increases of longer heat-press time, resin content, and density of board, respectively. 2.The mechanical properties of boards using the two higher F/P mole ratio types of PF resins were much better than those using the lower one. The mechanical properties of boards bonded with the lower NaOH/P mole ratio types of resin were much better.The properties of the boards using the resin synthesized with longer reaction time were also much better. 3. The IB of waferboards using powdered resins were lower than those of particleboards because of uneven distribution of powdered resins.