The Solvent Debinding Mechanism of Powder Injection Molded Compacts

碩士 === 國立臺灣大學 === 材料科學(工程)研究所 === 81 ===

Bibliographic Details
Main Authors: Young,Ming-Hsieh, 謝永明
Other Authors: Kuen,Shyang-Hwang
Format: Others
Language:zh-TW
Published: 1993
Online Access:http://ndltd.ncl.edu.tw/handle/35649685872657250889