Study of Processing Parameters Effect on the Reli- ability of Micro-bump Bonding

Study of Processing Parameters Effect on the Reli- ability of Micro-bump Bonding

碩士 === 國立清華大學 === 材料科學(工程)研究所 === 81 ===

Bibliographic Details
Main Authors:	Chang, Shyh-Ming, 張世明
Other Authors:	Jou, Jwo-Huei
Format:	Others
Language:	zh-TW
Published:	1993
Online Access:	http://ndltd.ncl.edu.tw/handle/85629765706142355637

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