Study of Processing Parameters Effect on the Reli- ability of Micro-bump Bonding

碩士 === 國立清華大學 === 材料科學(工程)研究所 === 81 ===

Bibliographic Details
Main Authors:	Chang, Shyh-Ming, 張世明
Other Authors:	Jou, Jwo-Huei
Format:	Others
Language:	zh-TW
Published:	1993
Online Access:	http://ndltd.ncl.edu.tw/handle/85629765706142355637

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spelling	ndltd-TW-081NTHU01590562016-07-20T04:11:47Z http://ndltd.ncl.edu.tw/handle/85629765706142355637 Study of Processing Parameters Effect on the Reli- ability of Micro-bump Bonding 製程參數對微凸塊接合信賴度之影響的研究 Chang, Shyh-Ming 張世明碩士國立清華大學材料科學(工程)研究所 81 Jou, Jwo-Huei 周卓煇 1993 學位論文 ; thesis 0 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立清華大學 === 材料科學(工程)研究所 === 81 ===
author2	Jou, Jwo-Huei
author_facet	Jou, Jwo-Huei Chang, Shyh-Ming 張世明
author	Chang, Shyh-Ming 張世明
spellingShingle	Chang, Shyh-Ming 張世明 Study of Processing Parameters Effect on the Reli- ability of Micro-bump Bonding
author_sort	Chang, Shyh-Ming
title	Study of Processing Parameters Effect on the Reli- ability of Micro-bump Bonding
title_short	Study of Processing Parameters Effect on the Reli- ability of Micro-bump Bonding
title_full	Study of Processing Parameters Effect on the Reli- ability of Micro-bump Bonding
title_fullStr	Study of Processing Parameters Effect on the Reli- ability of Micro-bump Bonding
title_full_unstemmed	Study of Processing Parameters Effect on the Reli- ability of Micro-bump Bonding
title_sort	study of processing parameters effect on the reli- ability of micro-bump bonding
publishDate	1993
url	http://ndltd.ncl.edu.tw/handle/85629765706142355637
work_keys_str_mv	AT changshyhming studyofprocessingparameterseffectonthereliabilityofmicrobumpbonding AT zhāngshìmíng studyofprocessingparameterseffectonthereliabilityofmicrobumpbonding AT changshyhming zhìchéngcānshùduìwēitūkuàijiēhéxìnlàidùzhīyǐngxiǎngdeyánjiū AT zhāngshìmíng zhìchéngcānshùduìwēitūkuàijiēhéxìnlàidùzhīyǐngxiǎngdeyánjiū
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Study of Processing Parameters Effect on the Reli- ability of Micro-bump Bonding

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