Study of Processing Parameters Effect on the Reli- ability of Micro-bump Bonding

• Main Authors: Chang, Shyh-Ming, 張世明
• Other Authors: Jou, Jwo-Huei
• Format: Others
• Language: zh-TW
• Published: 1993
• Online Access: http://ndltd.ncl.edu.tw/handle/85629765706142355637

碩士 === 國立清華大學 === 材料科學(工程)研究所 === 81 ===