| Summary: | 碩士 === 國立成功大學 === 化學工程研究所 === 81 === The goal of this research is focused on the syntheses of new,
high performance epoxy resins for printed circuit board
and semiconductor encapsulation. These novel materials will
fulfill the defect in the present materials.\ With
consistant increase in the computer memory capacity (from
64K to present 16M DRAM),present laminates and encapsulants do
not meet the harsh enviroment of prevailing surface mount
technology (soldering at 260℃),therefore the development of
high Tg epoxy resins which will result in a three dimensional,
tightly crosslinked structure is the purpose of this study.
Five novel three functional epoxy resins have been and cured
with various curring agent, Tgs of the cured were measured by
Thermomechanical analyzer (TMA)and compared with commonly used
cresol formaldehyde novolac epoxy (CNE) and A epoxy resins
(BPAE). The newly synthesized epoxy resins exhibited much
higher Tg than CNE and BPAE as expected, their mechanical
proporties have to be investigated further.
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