Preparation and Application of Novel Four Functional Epoxy Resin

• Main Authors: Kou Ming Huang, 黃國銘
• Other Authors: Zhen Hua Wang
• Format: Others
• Language: zh-TW
• Published: 1993
• Online Access: http://ndltd.ncl.edu.tw/handle/31307935010172031165

碩士 === 國立成功大學 === 化學工程研究所 === 81 === The goal of this research is focus on syntheses of novel fo- ur functional epoxy resin for semiconductor encapsulation appl- ication. With consistant increase in the computer memory capaci- ty( from 64 K to present 16 M DRAM ), The epoxy resins with high glass transition temperature is requried to withstand the severe environment of surface mount technology( semiconductor has to ex- pose to the soldering temperature). Owing to the chlorine im- purty in the resin may generate corrosive acid to the aluminum wire,high purity resin is required for the printed circuit board and semiconductor. The stress which is generated by the mismatch in the coefficient of thermal expansion among encapsulant ,sili- cone chip and metal frame is another question. The resins are modified with elastomer to withstand stress while maintain high Tg. In summary, development of high Tg resins with low chlorine content , moisture gain and stress failure are the purpose of this study.