| Summary: | 碩士 === 國立成功大學 === 化學工程研究所 === 81 === The goal of this research is focus on syntheses of novel fo- ur
functional epoxy resin for semiconductor encapsulation appl-
ication. With consistant increase in the computer memory
capaci- ty( from 64 K to present 16 M DRAM ), The epoxy resins
with high glass transition temperature is requried to withstand
the severe environment of surface mount technology(
semiconductor has to ex- pose to the soldering temperature).
Owing to the chlorine im- purty in the resin may generate
corrosive acid to the aluminum wire,high purity resin is
required for the printed circuit board and semiconductor. The
stress which is generated by the mismatch in the coefficient of
thermal expansion among encapsulant ,sili- cone chip and metal
frame is another question. The resins are modified with
elastomer to withstand stress while maintain high Tg. In
summary, development of high Tg resins with low chlorine
content , moisture gain and stress failure are the purpose
of this study.
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