The crosstalk and electromagnetic effect on packaging
博士 === 國立臺灣大學 === 電機工程學研究所 === 79 ===
Main Author: | 趙方麟 |
---|---|
Other Authors: | Chen, Shao-Jie |
Format: | Others |
Language: | zh-TW |
Published: |
1991
|
Online Access: | http://ndltd.ncl.edu.tw/handle/62375713167245380419 |
Similar Items
-
CONDUCTIVE AND INDUCTIVE CROSSTALK COUPLING IN VLSI PACKAGES
by: Voranantakul, Suwan, 1962-
Published: (1986) -
The Analysis and Optimal Compensationof the Differential Mode Crosstalk
by: Bang-Lin Liu, et al.
Published: (2004) -
Crosstalk-based analytical modelling of electromagnetic signatures for non-invasive testing of VLSI circuits and systems
by: Coulibaly, Lacina M.
Published: (2006) -
Electromagnetic Modeling and Measurement for Electrical Characteristics of Electronic Packages
by: Chih-Hsiang Ko, et al.
Published: (1999) -
The Study of Electromagnetic Interference Suppression and Modeling of System in Package
by: Ren-Fang Hsu, et al.
Published: (2015)