Study on the aluminum bond-pad corrosion in plastic-encapsulated IC package

碩士 === 國立中山大學 === 電機工程研究所 === 78 ===

Bibliographic Details
Main Authors:	LIU,ZHI-YUAN, 劉智遠
Other Authors:	WENG,HENG-YI
Format:	Others
Language:	zh-TW
Published:	1991
Online Access:	http://ndltd.ncl.edu.tw/handle/00119369294056332501

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record_format	oai_dc
spelling	ndltd-TW-078NSYS24420572015-10-13T12:47:23Z http://ndltd.ncl.edu.tw/handle/00119369294056332501 Study on the aluminum bond-pad corrosion in plastic-encapsulated IC package 積體電路愬膠包裝中鋁銲墊腐蝕之研究 LIU,ZHI-YUAN 劉智遠碩士國立中山大學電機工程研究所 78 WENG,HENG-YI 翁恒義 1991 學位論文 ; thesis 0 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立中山大學 === 電機工程研究所 === 78 ===
author2	WENG,HENG-YI
author_facet	WENG,HENG-YI LIU,ZHI-YUAN 劉智遠
author	LIU,ZHI-YUAN 劉智遠
spellingShingle	LIU,ZHI-YUAN 劉智遠 Study on the aluminum bond-pad corrosion in plastic-encapsulated IC package
author_sort	LIU,ZHI-YUAN
title	Study on the aluminum bond-pad corrosion in plastic-encapsulated IC package
title_short	Study on the aluminum bond-pad corrosion in plastic-encapsulated IC package
title_full	Study on the aluminum bond-pad corrosion in plastic-encapsulated IC package
title_fullStr	Study on the aluminum bond-pad corrosion in plastic-encapsulated IC package
title_full_unstemmed	Study on the aluminum bond-pad corrosion in plastic-encapsulated IC package
title_sort	study on the aluminum bond-pad corrosion in plastic-encapsulated ic package
publishDate	1991
url	http://ndltd.ncl.edu.tw/handle/00119369294056332501
work_keys_str_mv	AT liuzhiyuan studyonthealuminumbondpadcorrosioninplasticencapsulatedicpackage AT liúzhìyuǎn studyonthealuminumbondpadcorrosioninplasticencapsulatedicpackage AT liuzhiyuan jītǐdiànlùsùjiāobāozhuāngzhōnglǚhàndiànfǔshízhīyánjiū AT liúzhìyuǎn jītǐdiànlùsùjiāobāozhuāngzhōnglǚhàndiànfǔshízhīyánjiū
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Study on the aluminum bond-pad corrosion in plastic-encapsulated IC package

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