Thermally stable ohmic contacts to n-GaAs with Cr and TiW diffusion barriers

Thermally stable ohmic contacts to n-GaAs with Cr and TiW diffusion barriers

碩士 === 國立交通大學 === 光電(科學)研究所 === 78 ===

Bibliographic Details
Main Authors:	HUANG,JIAN-MING, 黃健銘
Other Authors:	LEI,TIAN-FU
Format:	Others
Language:	zh-TW
Published:	1990
Online Access:	http://ndltd.ncl.edu.tw/handle/56443323149047673651

Similar Items

A study on (TiW)Six/GaAs contacts
by: JIN,XUAN, et al.
Published: (1990)

An investigation of Tiw nitride and Tiw silicide schottky contacts to^^GaAs
by: WANG,SHENG-PING, et al.
Published: (1991)

TiW Nitride as an Annealing Encapsulant for Si Implanted GaAs
by: KANG PO ZENG, et al.
Published: (1993)

Thermally stable ohmic contacts to n-GaAs
by: XIA, SHAO-ZENG, et al.
Published: (1988)

Selective Cu-CVD and TiW Diffusion Barrier for Cu Metallization
by: Kuen-Chi Juang, et al.
Published: (1994)

Thermal stability of Pd-Ge base ohmic contact with diffusion barriers to N-GaAs
by: HUANG,WEN-CHANG, et al.
Published: (1991)

Diffusion barrier layer properties of TiW and TiWNthin films in copper metallization system
by: Joong-Fa Chen, et al.
Published: (2001)

Optimization of Ohmic Contacts to p-GaAs Nanowires
by: Marcelo Rizzo Piton, et al.
Published: (2019-11-01)

The Stress Analysis of GaN MSM Photodetectors with TiW Electrodes
by: Wen-Hsuan Hsu, et al.
Published: (2008)

The Fabrication and Reliability Testing of Deep-Submicron TiW/ TiSi2 Contacts
by: Chen, Li-Zen, et al.
Published: (1997)

The Fabrication and Reliability Testing of Deep-Submicron TiW/ TiSi2 Contacts
by: Chen, Li-Ren, et al.
Published: (1997)

Au-Ge-Pt and Au-Ge-Cr Ohmic contact on GaAs/AlGaAs MODFET structure
by: WU,SHENG-YUAN, et al.
Published: (1990)

Study of Pd/Ge/Mo(Cr)/Cu ohmic contact in InGaP/GaAs HBTs
by: Tung-Ling Hsieh, et al.

A study of in-based ohmic contacts to n-GaAs
by: Fu, Hao Zheng, et al.
Published: (1995)

Ohmic contacts to the two dimensional electron gas of GaAs-A1GaAs heterostructures
by: Chabasseur-Molyneux, Vincent Robert
Published: (1998)

THE STUDY OF NON-ALLOYED OHMIC CONTACTS ON InGaAs/GaAs LAYERS
by: Jeong-Shiuh Chen, et al.
Published: (1993)

The study of ohmic contact on GaAs surface passivated by plasma treatment
by: Shin-Chi Chien, et al.
Published: (2001)

A microstructural investigation of NiAuGe ohmic contacts to N-type GaAs with a zirconium diboride diffusion barrier
by: Grimshaw, Michael Peter
Published: (1990)

Study on ohmic contact to n-GaAs with AuGeNi/Au
by: Cheng-Chiang Wang, et al.
Published: (2003)

A study on the ohmic contact characteristics of InGaPN growth on GaAs heterojunction
by: Chiung-Yi Huang, et al.
Published: (2004)

Double-Sided Nonalloyed Ohmic Contacts to Si-doped GaAs for Plasmoelectronic Devices
by: Takaaki Mano, et al.
Published: (2019-04-01)

A microstructural investigation of AuGe and NIAuGe OHMIC contacts of GaAs
by: Zhang, Xiaomei
Published: (1987)

Orthogonal chemical functionalization of titanium tungsten (TiW) based surfaces
by: Zhang, Jian
Published: (2018)

Fully Cu-Metallized InGaP/GaAs HBTs Using Pd/Ge/Cu Ohmic Contact to N-type GaAs
by: Sheng-Li Shie, et al.
Published: (2008)

Study of Cr/Al bilayer Ohmic contact on n-GaN
by: Yang,Zong-Han, et al.
Published: (2010)

The Au/Ni(Pd)/Ge/n-GaAs ohmic contact behavior at low temperature
by: SHI,XUE-HAO, et al.
Published: (1991)

GaN Schottky Diode with TiW Electrodes on Silicon Substrate Based on AlN/AlGaN Buffer Layer
by: Sheng-Po Chang
Published: (2012-01-01)

Au-Free Fully Cu-Metallized InGaP/GaAs HBTs Using Pd/Ge/Cu Ohmic Contact to N-type GaAs
by: Chia-Ching Lin, et al.
Published: (2006)

DEVELOPMENT OF In[x]Ga[1-x]As-BASED OHMIC CONTACTS TO n-TYPE GaAs PREPARED BY RF-SPUTTERING
by: Uchibori, Chihiro
Published: (2012)

Study of Ohmic Contact to N-type GaAs substrate with Multi-layered Gold-contained structure
by: Ren-Hao Chen, et al.
Published: (2009)

Diffusion Behaviors of Si and Ge in GaN and Application of Ohmic Contacts
by: Bu, Chie Jin, et al.
Published: (1997)

Ti/Al Ohmic Contacts to n-Type GaN Nanowires
by: Gangfeng Ye, et al.
Published: (2011-01-01)

The study of Sputtering TiW thin films using RF magnetron by Taguchi Method
by: Chiang I-Che, et al.
Published: (2016)

Study of multi-layer copper-contained ohmic contact structure on p-type GaAs and its application
by: Chih-Yuan Lin, et al.
Published: (2007)

Study of multi-layered copper-contained ohmic contact structure on n-type GaAs and its application
by: Chen-I Hsieh, et al.
Published: (2007)

Desenvolvimento de nano-osciladores utilizando litografia de máscaras duras de TiW
by: Benetti, Luana Carina
Published: (2016)

Formation Mechanism of Ti Alloyed Ohmic Contacts to n-type GaN
by: Quantum Ker, et al.
Published: (2004)

The Study of TiW & W Transparent Electrodes and its Application in Nitride-Based Lights Emitting Diodes and Photodetectors
by: Hsin-Liang Liu, et al.
Published: (2005)

Metal/Semiconductor Barrier Properties of Non-Recessed Ti/Al/Ti and Ta/Al/Ta Ohmic Contacts on AlGaN/GaN Heterostructures
by: Monia Spera, et al.
Published: (2019-07-01)

Sputtered thin film diffusion barriers for ohmic contact to silicon by platinum electrodes
by: Taylor, Jeffrey Charles
Published: (2019)

Cannot write session to /tmp/vufind_sessions/sess_e2dp2ic483gdm7mddss70p33gq