Study of wafer warpage problems due to film Stress in the fabrication process of dielectric-isolated substrate

碩士 === 國立交通大學 === 光電(科學)研究所 === 77 ===

Bibliographic Details
Main Authors:	ZHOU, SI-MING, 周賜明
Other Authors:	CHEN, MAO-JIE
Format:	Others
Language:	zh-TW
Published:	1988
Online Access:	http://ndltd.ncl.edu.tw/handle/18620230310055711837

id	ndltd-TW-077NCTU2123048
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spelling	ndltd-TW-077NCTU21230482016-07-29T04:13:08Z http://ndltd.ncl.edu.tw/handle/18620230310055711837 Study of wafer warpage problems due to film Stress in the fabrication process of dielectric-isolated substrate 絕緣隔離基片製程中由於薄膜應力造成晶片彎曲問題之研究 ZHOU, SI-MING 周賜明碩士國立交通大學光電(科學)研究所 77 CHEN, MAO-JIE LEI, TIAN-FU SU, XIANG 陳茂傑雷添福蘇翔 1988 學位論文 ; thesis 0 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立交通大學 === 光電(科學)研究所 === 77 ===
author2	CHEN, MAO-JIE
author_facet	CHEN, MAO-JIE ZHOU, SI-MING 周賜明
author	ZHOU, SI-MING 周賜明
spellingShingle	ZHOU, SI-MING 周賜明 Study of wafer warpage problems due to film Stress in the fabrication process of dielectric-isolated substrate
author_sort	ZHOU, SI-MING
title	Study of wafer warpage problems due to film Stress in the fabrication process of dielectric-isolated substrate
title_short	Study of wafer warpage problems due to film Stress in the fabrication process of dielectric-isolated substrate
title_full	Study of wafer warpage problems due to film Stress in the fabrication process of dielectric-isolated substrate
title_fullStr	Study of wafer warpage problems due to film Stress in the fabrication process of dielectric-isolated substrate
title_full_unstemmed	Study of wafer warpage problems due to film Stress in the fabrication process of dielectric-isolated substrate
title_sort	study of wafer warpage problems due to film stress in the fabrication process of dielectric-isolated substrate
publishDate	1988
url	http://ndltd.ncl.edu.tw/handle/18620230310055711837
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Study of wafer warpage problems due to film Stress in the fabrication process of dielectric-isolated substrate

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